![]() and Guy Burgess, Flip Chip International, LLC Session 3 Fabrication of Tapered Through-Vias on (100) Silicon for Wafer-Level Packaging.22 Huang Shuang Wu and Chia Yong Poo, Micron Semiconductor Asia Pte Ltd. and Pascal Couderc, Ph.D., 3D PLUS Squeegee Influence on Bump Metrics for Stencil Printed Wafers.16 Jeff Schake, DEK USA Inc. Burghartz, Delft Institute of Microelectronics and Submicron Technology Wafer Level Stacking of 8 to 10 Dice per mm for Consumer Products Wireless Die-on-Die WDoD.10 Christian Val, Ph.D. Winkler, Electronic Trend Publications WAFER-LEVEL PACKAGING AND PROCESS MATERIALS TRACK Session 1 RF Crosstalk Suppression Based on Wafer-Level Packaging Concept.5 S.M. ![]() ![]() The IC Packaging World and Its Latest Developments.3 Sandra L. Jan Vardaman, TechSearch International, Inc. 57 Morehouse Lane Red Hook, NY USA Phone: Fax: Web:ģ TABLE OF CONTENTS Opening Session: Business and Marketing Issues of Wafer-Level and IC Packaging The Expansion of Wafer-Level Packaging: Challenges and Opportunities.1 E. Surface Mount Technology Association (SMTA) 6600 City West Parkway Eden Prairie, MN USA Phone: (952) Fax: (952) Additional copies of this publication are available from: Curran Associates, Inc. (2017) For permission requests, please contact Surface Mount Technology Association (SMTA) at the address below. Copyright (2006) by Surface Mount Technology Association (SMTA) All rights reserved. 57 Morehouse Lane Red Hook, NY Some format issues inherent in the e-media version may also appear in this print version. 2 Printed from e-media with permission by: Curran Associates, Inc.
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